Bondability Evaluation of Pressureless Sintering Copper Die-Bonding Paste

Role of process parameters on bondability and pad damage indicators in copper ball bonding

Cu wire bonding is one of the hottest trends in electronic packaging due to the cost and performance advantages of Cu wire over Au wire. However, there are many challenges to Cu wire bonding, one of which is the increased stress transmitted to the bond pad during bonding. This high stress is not desirable as it leads to pad damage or cratering in the Si under the pad. Another issue is pad splas...

PRESSURELESS SINTERING OF B4C-NANOTiB2 NANOCOMPOSITE BY ADDITION OF Fe AND Ni AS SINTERING AIDS

B4C and its composites with TiB2 as second phase continues to be extensively used as the preferred ceramic material in military applications as armor systems for absorbing and dissipating kinetic energy from high velocity projectiles. It also exhibits a high melting point (2427 °C), and high neutron absorption cross section. Pressureless sintering of the B 4C-nanoTiB2 nanocomposite using small ...

Semiconductor Die Bonding

Adhesive die attach materials are suspensions of metal particles in a carrier. The particles are several μm in size, usually in the form of thin flakes of silver. The carrier provides adhesion and cohesion to make a bond with the correct mechanical strength, while the metal particles provide electrical and thermal conductivity. It is noticeable that conductive resins are now often used where no...

Effect of LiYO2 on the synthesis and pressureless sintering of Y2SiO5

Densification Kinetics and Structural Evolution During Microwave and Pressureless Sintering of 15 nm Titanium Nitride Powder

Microwave sintering (MWS) of commercially available 15-nm-size nanocrystalline TiN powder was studied. Densification kinetics and grain growth mechanisms of nano-TiN were evaluated using non-isothermal heating up to 1500 °C with variable heating rates. A true nanocrystalline ceramic with ~80-nm-size grains and 94.5 % theoretical density was obtained via MWS consolidation at 1400 °C. At higher t...